Product Description:
Diffusion furnace to meet the main industry, electronic semiconductor electric power integrated circuit industry, diffusion, oxidation, annealing, alloy process for the machining of silicon wafer. Mainly by the diffusion furnace heating furnace, gas supply system, control system, cleaning operating system. Operating the computer micro control or program control mode.

The main technical indicators: ★ can handle wafer size: 2 - 8 inches ★ appearance forms: horizontal 1 - 4 tube structure making ★ working temperature: 200 ℃ - 1300 ℃ The length and accuracy. Constant temperature zone: 200mm - 1100mm ≤ ± 0.5 ℃ making ★ single point temperature stability, repeatability: ≤ ± 0.5 ℃ / 24h ★ temperature ramp: controllable heating rate of 20 ℃ / min, making ★ controlled cooling rate: 5 ℃ / min ★ feeding device: automatic cantilever push and pull, push and pull rod is boat boat, manual push and pull making ★ pneumatic system: 1 - 5 process gas / tube ★ gas control: MFC automatic, manual float flowmeter making making ★ control mode: IPC, touch screen